Quanxin Semiconductor Technology (Wuxi) Co., Ltd

Functional Features
◆The structure is rationally designed and the process technology is mature.
◆It offers excellent spin - drying results and high process cleanliness.
◆It has low vibration, high reliability, and is suitable for thin wafers.
◆It is easy to operate and convenient to maintain. The whole machine runs stably and reliably.
Technical Parameters
◆The wafer size is suitable for 1 - 12 - inch production lines.
◆The wafer breakage rate is one in ten thousand.
Application Fields
◆Spin - drying of wafers in various process technologies such as SPM acid cleaning, organic cleaning, development, photoresist stripping, ITO etching, BOE etching, and photoresist coating.
Equipment Functions
◆The equipment is available in single - chamber and dual - chamber models. It is used for the wet - process spin - drying of various semiconductor application materials, including standard - sized wafers of 1 - inch, 2 - inch, 4 - inch, 5 - inch, 6 - inch, 8 - inch, and 12 - inch, non - standard round and square wafers, silicon wafers, potassium nitride, gallium arsenide, sapphire, and photomasks.

Functional Features
◆Driven by a brushless servo motor to ensure the stable and reliable operation of the equipment and meet the cleanliness requirements.
◆Adopts a labyrinth - type nitrogen sealing design, which isolates the interior and exterior of the chamber. The contact - less sealing effect ensures the requirements of the process environment.
◆Equipped with PTFE pneumatic control valve components, PVDF pipelines, and joints.
◆Made of 316L stainless steel with surface electropolishing treatment.
◆It has functions of rinsing, blowing, drying, and baking. By using the centrifugal force generated by high - speed rotation, it can remove residual chemical reagents and particulate dust adhered to the surface. At the same time, clean nitrogen can carry away the remaining particulate dust, making the product surface clean and dry.
◆Has an electrostatic elimination function. When the product moves at a high speed, static electricity will be generated. A high - voltage electrostatic elimination device is used to neutralize the surface of the product.
◆Conductivity monitoring is carried out to monitor the quality of the cleaning water and whether there is excessive residual chemical reagents and particulate dust on the product surface. If it does not meet the requirements before spin - drying, it will give a prompt and warning to prevent defective products from entering the next process.
◆The stainless - steel heater is heated by nitrogen, and the heating film heats the cavity. It has PID temperature accuracy control and can be pre - heated if needed. There is an option for automatic cleaning, and the interval time can be set to ensure that the equipment is always kept clean.
◆Nitrogen is filtered to 0.003UM to ensure the cleanliness of the process gas.
◆Has a mechanical self - reset function. When the machine stops or is on standby, the wafer cassette faces upward.
◆It has protection functions based on conditions such as nitrogen pressure, door sealing status, and the orientation of the wafer cassette.
◆The control unit can be controlled and operated independently. It is easy to operate and convenient to maintain.